Materials and Electronics Engineering

Preparation of carbon nanowalls and the application in chip cooling

Yan Zhang1,*, Chuyun He1, Shiwei Ma1, Haomin Wang1, Johan Liu1,3

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1SMIT Center, School of Mechatronics Engineering and Automation & Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, Shanghai, China
2State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China
3Bionano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg, Sweden

Materials and Electronics Engineering 2014,1:8

Publication Date (Web): December 19, 2014 (Article)


*Corresponding author. E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.




Figure 8 (a) IR image of the chip without CNW; (b) the temperature distribution along the centerline of the chip without CNW; (c) IR image of the chip with CNW; (b) the temperature distribution along the centerline of the chip with CNW.

      Carbon nanomaterials, such as fullerenes, carbon nanotube or nanofiber, graphene and so on, have been the frontier of innovation of science and technology in the past decades. Applications of the advance nanomaterials in electronics have also been investigated. In the present paper, the preparation of carbon nanowall (CNW) has been carried out by a plasma enhanced chemical vapor deposition (PECVD) method. The characterization of the CNW samples has been carried out by scanning electron microscope (SEM) and Raman spectra. Then the carbon nanowalls have been applied on a thermal test chip to evaluate its thermal properties. The infrared (IR) thermal imaging is adopted to record the surface temperature of the chip. The thermal performance of carbon nanowall in chip cooling effect is evaluated. And the comparison of the temperature distributions of test chips with and without carbon nanowalls shows quite promising results.



Carbon nanowall, PECVD, thermal performance, chip cooling